vlsi conference cool chips
CALL FOR PARTICIPATION [pdf version is here].
“Device Cloud Computing”
Shih-Wei Liao (Google Inc., USA)
Carlotta Guiducci (EPFL, Switzerland)
“POWER7: IBM’s Next Generation Server Processor”
Jim Kahle (IBM Corp., USA)
“Super Camera Technology at NHK”
Hiroshi Shimamoto (NHK Engineering Services, Inc., Japan)
Topics: “What is the Future Multi-layer Co-design of Computer Systems?”
organizer: Fumio Arakawa (Renesas Tech., Japan)
Special Sessions (invited lectures)
“Convergence of Design and Fabrication Technologies, a Key Enabler for Multi-layer HW-SW Integration”
Ahmed Jerraya (CEA-LETI, France)
“Achieving Fast Design Closure Using Networks on Chips”
Srinivasan Murali (EPFL/Inocs, Switzerland)
“Resolving the Grand Paradox: Low Energy and Full Programmability in 4G Mobile Baseband SOCs”
Chris Rowen (Tensilica, USA)
CALL FOR CONTRIBUTIONS [pdf version is here].
COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XIII is to be held in Yokohama on April 14-16, 2010, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. The COOL Chips Organizing Committee will ask the MICRO to publish selected papers in a special issue on COOL Chips XIII.
Contributions are solicited in the following areas:
Low Power-High Performance Processors, “Eco-Processors”, for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
Cool Software including Binary Translations, Compiler Issues and Low Power Techniques.
Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare an extended abstract using the given guidelines and template (Author’s kit pdf, doc). The status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality. Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made by e-mail,
to: Makoto Ikeda, Program Chair at submit_xiii”at”coolchips.org. (Please replace the “at” to @.)
January 15, 2010
January 25, 2010
Extended Abstract Submission (by e-mail)
March 1, 2010 Acceptance Notified (by e-mail)
March 15, 2010 Final Manuscript Submission
You are also invited to submit proposals for poster sessions by e-mail, to: M. Muroyama, Poster Chair at poster_xiii”at”coolchips.org. (Please replace the “at” to @.)
Authors Schedule (Poster):
March 8, 2010 Poster Abstract Submission (by e-mail)
March 15, 2010 Acceptance Notified (by e-mail)