rf design and package of rfic
There are three main ISM bands for RF and wireless chips: 902 – 928 MHz, 2.400 – 2.500 GHz, and 5.725 – 5.875 GHz. There are many different IC package types. Examples include ball-grid array (BGA), flip chip ball-grid array (FCBGA), plastic ball-grid array (PBGA), multi-chip module plastic ball-grid array (MCM-PBGA), super ball-grid array (SBGA), tape ball-grid array (TBGA), pin-grid array (PGA) ceramic pin-grid array (CPGA), plastic pin-grid array (PPGA), and flip-chip pin-grid array (FCPGA). RF and wireless chips are also available in IC package types such as chip scale package (CSP), ultra chip scale package (UCSP), wafer-level chip-scale package (WLCSP), quad flat package (QFP), and low quad flat package (LQFP).