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plastic IC package


On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

FREE-DOWNLOAD H Guojun… – Electronic Components and Technology …, 2005
. Finite element models were constructed for a 160-leaded PQFP package. . Manufacture- induced
small voids or defects in interfaces of plastic IC packages due to the thermal expansion mismatch
of the packages generally become potential sites for delamination .





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