ELECTRONICS COMPONENTS SALES AND SERVICE

THERMAL MANAGEMENT DESIGN DEVELOPMENT TESTING


Thermal Management is the ability to control the temperature of a system by means of Technology based on Thermodynamics and Heat Transfer. the technology of the generation, control and dissipation of heat generated in electronic devices and systems. Heat is an inevitable by-product of every electronic device, and is usually disadvantageous to performance and reliability. The electronic packaging trend has been to reduce size and increase performance of the product, both of which contribute to exponential increase in power consumption of the system.

Battery thermal management in EV and HEVs: issues and solutions
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ABSTRACT Thermal management of batteries in electric vehicles (EVs) and hybrid electric vehicles (HEVs) is essential for effective operation in all climates. This has been recognized in the design of battery modules and packs for pre-production prototype or production EVs

Event-driven energy accounting for dynamic thermal management
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ƠIf critical temperature is reached throttle the CPU (eg halt cycles, stop clock mechanism) or stop the processor executionƠBut: neglect of application-, user-or service-specific requirements due to missing online information about the originator of a specific hardware

Power and Thermal Management in the Intel Core Duo Processor.
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ABSTRACT The IntelCore Duo processor is the first mobile processor that uses Chip Multi-Processing (CMP) on-die technology to maximize performance and minimize power consumption. This paper provides an overview of the power control unit and its impact on

Dynamic thermal management for distributed systems
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Page 1. Dynamic ThermalManagement for Distributed Systems Light emitting diodes (LEDs) are a solid-state lighting source increasingly being used in display backlighting, communications, medical services, signage, and general illumination. LEDs offer design flexibility, have small exterior outline dimensions, higher energy

Event-driven thermal management in SMP systems
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Abstract Actions usually taken to prevent processors from overheating, such as decreasing the frequency or stopping the execution flow, also degrade performance. Multiprocessor systems, however, offer the possibility of moving the task which caused a CPU to overheat

Parameterization and observability analysis of scalable battery clusters for onboard thermal management
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Although the battery surface temperature is commonly measured, the core temperature of a cell may be much higher hence more critical than the surface temperature. The core temperature of a battery, though usually unmeasured in commercial applications, can be

Thermal management solutions utilizing high thermal conductivity graphite foams
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ABSTRACT The recent development of light weight foams has led to novel light weight high strength carbon based materials and structures. These materials exhibit very high specific strengths and low thermal conductivities. Likewise, the novel development of a very high

Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers
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Thermal management will play a pivotal role in the coming decade for all types of electronic products. Increased heat fluxes at all levels of packaging from chip to system to facility pose a major cooling challenge. To meet the challenge significant cooling technology

Thermal management of hybrid vehicle battery systems
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Abstract Complete system design, including mechanical, electrical and thermal control, is critical to realize the benefits of Li-Ion technology in automotive batteries. In order to meet the technical requirements in a demanding automotive environment efficient thermal and

LED thermal management
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Light Emitting Diodes (LEDs) have been around for years, primarily concentrated as the lighting source for a variety of applications. Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. The junction temperature of the

Battery thermal management system of future electric vehicles with loop thermosyphon
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ABSTRACT This work reports the experimental results of the thermal management of a Li- ion battery system designed for a future hybrid and electric vehicles. Specially, the present thermal management system has adopted a loop thermosyphon cooling method for high

Near-junction thermal management : Thermal conduction in gallium nitride composite substrates
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The thermal management challenge posed by gallium nitride (GaN) high-electron-mobility transistor (HEMT) technology has received much attention in the past decade. The peak amplification power density of these devices is limited by heat transfer at the device,

Aluminum silicon carbide (AlSiC) for cost-effective thermal management and functional microelectronic packaging design solutions
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Abstract Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for electronic packaging applications requiring thermal management solutions. The AlSiC coefficient of thermal expansion (CTE)

Thermal management analysis of a Lithium-ion battery pack using flow network approach
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Abstract-Among various issues that high power application lithium-ion (Li-ion) batteries are encountered, thermal issues have received more attention because of their potential to degrade battery performance. In the present work, a lumped capacitance heat transfer

Thermal management strategies for embedded electronic components of wearable computers
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Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of

Using metal core printed circuit board (MCPCB) as a solution for thermal management
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Thermal conductivity is a material property that describes the ability of a material to conduct heat after the heat has entered the material. As shown in Table 1, conventional PCB materials such as FR4 and PI share the lowest thermal conductivity and are not capable of

Properties of SiC and AlN feedstocks for the powder injection moulding of thermal management devices
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Aluminium nitride (AlN) and silicon carbide (SiC) were chosen for the fabrication of thermal management devices due to their high thermal conductivity and coefficient of thermal expansion values equivalent to that of silicon and silicon carbide dies. Additionally, powder

Thermal management of high performance microprocessors in burn-in environment
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Abstract In deep sub-micron technologies, increased standby current in high performance processors will result in increased junction temperature. Elevated temperature will have positive feedback on the standby current. If the temperature is not controlled, it may lead to

Thermal management with asymmetric dual core designs
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Abstract Thermal considerations play an increasingly important role in the design of new processors. Thermal concerns impact how chips are laid out, how quickly processors can be clocked, processor reliability, and how expensive the packaging is. Current production chips

Thermal management and blood loss during hip arthroplasty
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Perioperative hypotermia is a common, but preventable complication of anaesthesia and surgery. Mild perioperative hypothermia increases the incidence of morbid myocardial outcomes, reduces resistance to surgical wound infections, and prolongs both The materials aspect of electronic packaging and thermal management is a rapidly developing area. This is especially true for composite materials; thus, the TMS/ASM Composites Committee held a two-session symposium-Novel Materials for Electronic

Thermal management of harsh-environment electronics
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As the trend of highly integrated electronics and simultaneous miniaturization escalates to include faster processors, more functions, and higher bandwidths, electronics continue to become more compact in response to size limitations and strict reliability requirements. The

Improving battery thermal management using design for six sigma process
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Abstract Battery thermal control is an important factor for achieving desired performance and calendar life for multi-cell batteries in hybrid electric vehicles. Automakers and their battery suppliers are paying increased attention to battery thermal management especially with

Microscale thermoelectric devices for energy harvesting and thermal management
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Abstract Superlattice material technologies in the Bi2Te3-material system can potentially enable efficient micro-scale thermoelectric devices for energy harvesting and active site- specific thermal management from~ 200K to~ 400K. The state-of-the-art in these thin film Thecontinuing demand for increased electronic device performance has led to very large- scale integration (VLSI) circuil Iet: hnology, using complementary metal oxide semiconductor (CMOS), emitter-coupled logic (ECL) and dynamic randomaccess memory (DRAM)

Thermal management enhancement for GaAs Devices using CVD diamond heat spreaders in a plastic package environment
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Long term package reliability is becoming an increasing concern as IC clock speeds and power densities increase while simultaneously the package foot print decreases. Significant contributors to increasing the reliability and performance of plastic packages are reducing

Interlayer thermal management of high-performance microprocessor chip stacks
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A Framework for Thermal and Performance Management.
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Within this context, dynamic thermalmanagement techniques (DTM) can be highly beneficial in proactively control heat dissipation, avoiding overheatingPreventive thermalmanagement is a technique to achieve long-term thermal control via performance degra- dation

An integrated thermal architecture for thermal management of high power electronics
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ABSTRACT: This paper presents a thermal architecture concept for analysis of thermal problems and solutions existing in electronics systems. The thermal problems are categorized into a total of seven levels from chip to system. Advanced thermal technologies

Efficient Design Practices for Thermal Management of TSV based 3D IC System
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IC ThermalManagement 3D IC Thermal Evaluation Thermal

Leakage and variation aware thermal management of nanometer scale ICs
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AbstractFor sub-100 nm CMOS technologies, leakage power forms a significant component of the total power dissipation, especially due to within-die and die-to-die variations in process (P), temperature (T) and supply voltage (V). Since leakage power and

Basic thermal management of power semiconductors
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Thermal management of power semiconductors is often overlooked by design engineers, either through oversight, misconception, inexperience, or even perceived unimportance. Then it is only addressed when the system is ready for packaging and by that time, it may be

Thermal management of electronic servers under different power conditions
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Abstract An experimental study of thermal management of rack of servers of a data centers is presented for different schemes of serverpower loadings. Four scheme of server power loading (uniform, discrete, segmented and clustered) are considered. A total of eleven cases

Thermal management of electromechanical actuation on an all-electric aircraft
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Abstract This report addresses the thermal management of electromechanical flight control actuators on an all-electric aircraft (AEA). Information relating all-electric aircraft, electromechanical actuators (EMAs) and thermal management concepts is presented and

A cooling system with a fan for thermal management of high-power leds
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Abstract To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26ºC. Results show that the

Decentralised voltage and thermal management to enable more distributed generation connection
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ABSTRACT This paper presents a decentralised control scheme of a distributed generator to actively respond to voltage and thermal issues in a distribution network. An operation scheme providing a local voltage control by adjusting the reactive power output of the

Thermal management technology for IGBT modules
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ABSTRACT In power conversion systems that use IGBT modules, the thermal conductivity of the thermal grease utilized is designed as low as possible. As a result, the thermal grease thickness affects the IGBT chip temperature. This paper describes the effects of the hardness The objective of the ITEM (Integrated ThErmal Management ) project is to specifically address thermal management of high-density embedded systems by developing a set of innovative scalable techniques that provide: 1. a flexible thermal management system with

Integrated Vehicle Thermal Management : Combining Fluid Loops in Electric Drive Vehicles
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Added inverter model (based on feedback from Electrical and Electronics Technical Team) Updated battery thermal model based on review with the NREL ESS group (battery properties and thermal performance)Added ability to heat battery coolant to improve

Thermal management simulation for passenger cars-towards total vehicle analysis
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ABSTRACT A systematic study of simulating the air-cooling system of a passenger car under- hood was carried out. Simulations were performed using the Lattice-Boltzmann Method (LBM), this allowed efficient handling of the complex geometries, typical for passenger car

Thermal management with solid-fluid slip irreversibility treatment in conjugate microdevices
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A numerical study of the effect of slip flow irreversibility and axial conduction in microdevices with a conjugate heat transfer between unmixed streams is presented. The effects of axial conduction due to parallel flows for thermal management in energy systems are

Thermal management in embedded systems
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Abstract By designing a dynamic thermal management system using dynamic frequency scaling, based on the architecture of the Intel 80200 processor, this thesis project shows how thermal management systems can be retrofitted to current embedded devices. In doing

Thermal management of Fujitsuhigh-performance servers
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With the continued increase in power dissipation and power density of high-performance microprocessors, as well as requirements for high-density packaging and lower device junction temperatures, improvements of electronic cooling technologies have been

Novel battery thermal management system for greater lifetime ratifying current quality and safety standard
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Temperature excursions and non-uniformity of the temperature inside the battery systems are the main concern and drawback for any attempt to scale-up battery cells to the larger sizes as required for high power applications. The applications may include electric

Discontinuous Graphite Reinforced Aluminum, and Copper Alloys for High Thermal Conductivity-Thermal Expansion Matched Thermal Management
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Thermal management has become a key enabling technology for next generation military and commercial electronics. Trends in electronics-system miniaturization (multichip packaging), increased power, higher frequency, and greater functionality has created a

The challenging task of thermal management
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Abstract The constant increase of power densities inside of power electronic components is an omnipresent trend that in future is going to continue. One of the consequences related to this trend is a constant increase of junction temperatures in power electronic devices. With

System model of engine thermal management
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1. ABSTRACT Engine thermal management is an area that covers a multitude of design tasks associated with the development of engines and vehicles. It concerns many different components of the system, and for each a variety of design objectives. An integrated design

Thermal Management in a Coal-Based SOFC Hybrid Through Numerical Simulation
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The role of controlled interfaces in the thermal management of copper carbon composites
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Electronic packaging refers to the protective features and safety devices that enable continued and efficient operation of electronic components, and does not refer to shipping containers. Electronic components typically refer to assemblage of resistors, capacitors,

3D structuration of LTCC and related technologies for thermal management and microfluidic structures
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Abstract: Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing

Synjet thermal management technology increases led lighting system reliability
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Electronic system reliability is typically a function of ambient temperature. In many systems, an increase in temperature by 10 C to 20 C will cut the lifetime in half. LEDs in solid state lighting are subject to the same decrease in lifetime and also their light output quantity

Thermal management and engineering economics in CPV design
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Heat Pipe Assisted Thermal Management of a HT PEMFC Stack
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Abstract: Heat management is crucial for the satisfactory operation of HT-PEM (High temperature polymer-electrolyte-membrane) fuel cells. Current work investigates the use of heat pipes in a HT PEMFC stack consisting of 24 cells, each with an active area of 300 cm².

Thermal Management Systems Roadmap
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NASAintegrated technology roadmap, including both technology pull and technology push strategies, considers a wide range of pathways to advance the nationcurrent capabilities. The present state of this effort is documented in NASADRAFT Space Technology

On-chip thermal management of nanoelectronic hot spots
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Page 1. On-Chip ThermalManagement of Nanoelectronic Hot Spots A. Bar-Cohen, P. Wang Department of Mechanical Engineering University of Maryland College Park InterPack Tutorial ASME InterPack Conference 2011 Portland, OR Page 2. 2 On Chip ThermalManagement of

Thermally conductive but electrically insulating plastics for thermal management applications
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Abstract Boron nitride (BN) is a synthetic ceramic material that exhibits both excellent thermal conductivity and dielectric properties. Loading BN into thermoplastic resins therefore enables unique composite materials that are thermally conductive but electrically insulating.

Thermal management using planarized CVD-diamond substrates
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Abstract CVD diamond (CVDD) substrates offer an outstanding solution for various advanced electronic packaging applications such as high power 3-D MCMS, laser diodes, and high power MOSFETs. In the manufacturing of such substrates, various post-synthesis

ELECTRONICS COMPONENTS SALES AND SERVICE-INTEGRATED CIRCUIT-ANALOG, DIGITAL, DSP, RF IC, WIRLESS IC, VLSI, CAPACITOR, RESISTOR, INDUCTOR, PCB, MODULE, SENSOR